The 29th International Conference on Amorphous and Nano-crystalline Semiconductors-Hui Fang (Topic 2)

Hui Fang

Silicon Thin Film

Dartmouth College (USA), 15 Thayer Drive, Hanover, NH 03755 USA

Email: hui.fang@dartmouth.edu

Biography

Hui Fang received his B.S. degree in 2009 from Tsinghua University and his Ph.D. degree in 2014 from the University of California, Berkeley, both in Materials Science and Engineering. He was then a postdoctoral fellow at the University of Illinois, Urbana-Champaign from 2014 to 2016. After starting his independent career in August 2016, he joined Dartmouth College in July 2021 as an Associate Professor in the Thayer School of Engineering. Fang’s research interests encompass the fields of neuroelectronics, electronic materials, and electroactive organisms. His research has been recognized by multiple awards, including an NSF CAREER Award (2019), an NIH R01 Award (2020), and an NIH U01 Award (2021).

Abstract for Presentation

Transferred Si Thin Film for Implantable Bioelectronics

New forms of materials can often enable new device and system applications. In this talk, I will discuss our studies on transferred Si thin film materials for neuroelectronic applications. Firstly, because of their ultrathin nature and excellent mechanical flexibility, transferred Si thin film leads to large scale, high resolution soft electrode implants, enabling unprecedented bio-signal mapping capabilities for both the heart and brain. Secondly, I will introduce our recent concept on semiconductor nanomeshes. By making transferred Si thin film into homogeneous nanomeshes, we achieve high mobility semiconductors that are intrinsically stretchable to conventional microelectronic layouts. Together, our work demonstrates that transferred Si thin film is a unique approach to transforming conventional electronics for emerging applications.

References

[1] H. Fang, K.J. Yu, C. Gloschat, Z. Yang, E. Song, C.-H. Chiang, J. Zhao, S.M. Won, S. Xu, M. Trumpis, Y. Zhong, S.W. Han, Y. Xue, D. Xu, S.W. Choi, G. Cauwenberghs, M. Kay, Y. Huang, J. Viventi, I.R. Efimov, and J.A. Rogers, Nature Biomedical Engineering, 1, 0038, 2017.

[2] X. Han, K. J. Seo, Y. Qiang, Z. Li, S. Vinnikova, Y. Zhong, X. Zhao, P. Hao, S. Wang, and H. Fang, npj Flexible Electronics, 3:9, 2019.